Semiconductor device
US7649253B2 · kind B2 · utility
4Cited by
6References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jan 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device 1 includes a substrate 10, a semiconductor chip 20 (first semiconductor chip), semiconductor chips 30 (second semiconductor chips) and a heat sink 40. Semiconductor chips 20 and 30 are mounted on the substrate 10. The level of the top surface of the semiconductor chip 20 on the substrate 10 is lower than the level of the top surface of the semiconductor chip 30. A heat sink 40 is fixed to the semiconductor chip 20. Among the semiconductor chip 20 and the semiconductor chips 30, only above the semiconductor chip 20 is provided with the heat sink 40.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.