Conductive stiffener for a flexible substrate
US7649254B2 · kind B2 · utility
39Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jul 20, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.