Patent · US Expired

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

US7649266B2 · kind B2 · utility

6Cited by

9References

12Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Andreas Ploessl · Regensburg, DE
Stephan Kaiser · Regensburg, DE
Volker Harle · Hemau, DE
Berthold Hahn · Hemau, DE

Key dates

Filing date	Aug 1, 2005
Grant date	Jan 19, 2010
Priority date	—
Expiry date	Mar 9, 2026

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

For semiconductor chips (1) using thin film technology, an active layer sequence (20) is applied to a growth substrate (3), on which a reflective electrically conductive contact material layer (40) is then formed. The active layer sequence is patterned to form active layer stacks (2), and reflective electrically conductive contact material layer (40) is patterned to be located on each active layer stack (2). Then, a flexible, electrically conductive foil (6) is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.