Die design with integrated assembly aid
US7649372B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2008 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Feb 7, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and systems for inserting and replacing swaged probe pins in a lower die portion of a head having an array of micro-holes for receiving the probe pins are disclosed. The methods and systems include the following: swaged probe pins including substantially cylindrical ends and a swaged center portion; and an assembly aid film including an array of slotted holes, each of the slotted holes including a substantially round portion for receiving the substantially cylindrical ends of the swaged probe pins and slot portions for receiving the swaged center portion of the swaged probe pins. The array of slotted holes is configured to properly align the swaged probe pins with the array of micro-holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.