Connector-to-pad printed circuit board translator and method of fabrication
US7649375B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2006 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jun 26, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a laminated printed circuit board translator is provided. In some embodiments, the translator includes a receiving board adapted to receive a pin, the receiving board includes a plated via extending through the receiving board and has a hole for receiving a pin. An interface board laminated with the receiving board has a controlled depth via extending through it to contact a conductive trace. The conductive trace extends between the receiving board and the interface board to connect the plated via of the receiving board with the controlled depth via of the interface board. The controlled depth via is configured so that it is capable of being plated through a single sided drilled opening in the interface board. Some embodiments have a pad on the interface board connected to the controlled depth via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.