Systems and methods for detecting scratches on non-semiconductor wafer surfaces
US7649624B1 · kind B1 · utility
3Cited by
1References
29Claims
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Key dates
| Filing date | Jul 16, 2008 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jul 22, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/8806
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of detecting one or more scratches on a surface of a wafer made of a non-semiconductor material is provided. A UV beam is produced from a UV illumination source. The UV beam is incident on a front surface of the wafer. The UV beam being characterized that for scratches of a given material having a UV cutoff wavelength λcutoff, over 90% of the spectral system response SSR is at wavelengths below μcutoff−5 nm and expressed as:A reflected beam of scattering of the UV beam is detected in response to scratches on a surface of the wafer. The scattering is captured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.