Noncontract IC tag with non-conductive metal film
US7651033B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2006 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jul 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A noncontact IC tag 1 comprises a base film 11, a noncontact IC circuit 2, 3 formed on the base film 11, and a plastic film or paper serving as a surfacing sheet 4, having a non-conductive, lustrous metal film 6m formed by deposition, laminated to the base film 11 on the side of the noncontact IC tag circuit 2, 3. The surface roughness of the non-conductive, lustrous metal film 6m, determined by atomic force microscopy, is more than 10 nm and 100 nm or less as indicated by the center line average height Ra. In the case where the non-conductive, lustrous metal film 6m is formed on the outer surface of the surfacing sheet 4, a concealing layer 4a may further be formed on the inner surface of the surfacing sheet 4 in order to enhance concealing properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.