Surface acoustic wave pressure sensors
US7651879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2005 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | May 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4908
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Improved SAW pressure sensors and manufacturing methods thereof. A SAW wafer including a number of SAW transducers disposed thereon may be provided. A cover wafer may also be provided, with a glass wall situated between the cover wafer and the SAW wafer. The cover wafer may be secured to the SAW wafer such that the glass wall surrounds the SAW transducers. In some instances, the glass wall may define, at least in part, a separation between the cover wafer and the SAW wafer. One or more contours may also be provided between the cover wafer and the SAW wafer such that at least one of the contours surrounds at least one of the SAW transducers when the cover wafer is disposed over and secured relative to the SAW wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.