Laser beam projection mask, and laser beam machining method and laser beam machine using same
US7651931B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2005 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jan 31, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02691
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The laser beam projection mask 14 has three rectangular-shaped slits 25, 26, 27 as transmission areas. These three slits 25, 26, 27 are formed in sequence in X direction shown by an arrow X in FIG. 2C at specified intervals, and the width in the X direction decreases in the order of the slit 25, the slit 26 and the slit 27. More particularly, transmission coefficients of the transmission areas change in conformity with a temperature distribution curve V1 of a silicon film 4 shown in FIG. 2B.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.