Structure for a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
US7651957B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2004 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jan 12, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/1135
Abstract
The invention relates to a structure for a semiconductor arrangement. A resist structure for supporting deposition of a solution containing a semiconductor is directly or through intervening layers coupled to a substrate. The resist structure comprises a depression (301) for depositing of the solution containing the semiconductor (309) and a trough (305) aligning at least part of an edge of the depression (309) and separated from the depression (309) by a protrusion (307). The trough (305) preferably surrounds the depression (309). The trough provides a pinning effect on the solution containing the semiconductor thereby improving the wettability and accordingly allowing for increased volume of semiconductor to be applied to a given area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.