Patterning on surface with high thermal conductivity materials
US7651963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2006 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Aug 25, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2992
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides for high thermal conductivity paper that comprises a host matrix (10), and high thermal conductivity materials (12) added to a surface of the host matrix in a specific pattern (12). The high thermal conductivity materials are comprised of one or more of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers. In particular embodiments the specific pattern comprises one or more of a grid, edging, banding centering and combinations thereof and the high thermal conductivity materials cover 15-55% of the surface of the host matrix. Multiple surfaces, including sub layers may have patterning.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.