Microfluidic cooling of integrated circuits
US7652372B2 · kind B2 · utility
8Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2005 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Aug 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve within the microchannel may automatically operate, at least partially, to close off the microchannel, allowing the bubble to be freed and to be flushed from the channel in some embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.