Stress relief features for an overmolded base
US7652845B2 · kind B2 · utility
7Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2005 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jan 24, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B25/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base assembly for use in an airtight enclosure. The base assembly includes a metal stamped section and an overmold section formed adjacent to the metal stamped section. The overmold section includes at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.