Thermal management of extruder of molding system, amongst other things
US7653460B2 · kind B2 · utility
4Cited by
27References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2006 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29B7/38
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method of a molding system, the method comprising: determining whether a change in a thermal condition of an extruder is required based on a thermal condition of a zone of a melt passageway of the molding system, wherein setting of a threshold temperature of an extruder heater is adjusted based on a non-extruder sensor positioned away from the extruder but positioned proximate to the melt passageway, the melt passageway is also positioned external of the extruder, so that the non-extruder sensor is not negatively influenced by heat retained in the extruder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.