Modeling resolution enhancement processes in integrated circuit fabrication
US7653890B2 · kind B2 · utility
16Cited by
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20Claims
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Key dates
| Filing date | Apr 1, 2005 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Apr 1, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A Wafer Image Modeling and Prediction System (“WIMAPS”) is described that includes systems and methods that generate and/or apply models of resolution enhancement techniques (“RET”) and printing processes in integrated circuit (“IC”) fabrication. The WIMAPS provides efficient processes for use by designers in predicting the RET and wafer printing process so as to allow designers to filter predict printed silicon contours prior to application of RET and printing processes to the circuit design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.