Thermal management of systems having localized regions of elevated heat flux
US7654311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2006 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Jan 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal management system (300) includes a first heat transfer body (330) for providing a opposing heat flux to at least one localized region of elevated heat flux residing in adjacency to a region of lesser flux, such as on a surface (315a) of a circuit die (315) due to a integrated circuit hot-spot (310). A contact (320, 321 962a, 962b, 970a, 970b or 950) defines a thermal conduction path for the opposing flux. A second heat transfer body (350) is in a heat transport relationship with the first heat transfer boy (330) and a second heat transport relationship with the region of lesser heat flux. In such arrangement, each region of heat flux is provided a thermal solution commensurate with the level of heat flux in the region. For example, the opposing heat flux of an active first heat transfer body (330), such as a thermoelectric cooler, may be provided at the hot-spot (310), while at the same time the lesser heat flux is absorbed by a passive second heat transfer body (350), such as a heat spreader.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.