Methods and devices for evaluating the thermal exposure of a metal article
US7654734B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 2005 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Feb 21, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for evaluating the thermal exposure of a selected metal component which has been exposed to changing temperature conditions is described. The voltage distribution on a surface of the metal component, or on a metallic layer which lies over the component, is first obtained. The voltage distribution usually results from a compositional change in the metal component. The voltage distribution is then compared to a thermal exposure-voltage model which expresses voltage distribution as a function of exposure time and exposure temperature for a reference standard corresponding to the metal component. In this manner, the thermal exposure of the selected component can be obtained. A related device for evaluating the thermal exposure of a selected metal component is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.