Etching
US7655152B2 · kind B2 · utility
1Cited by
27References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2004 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Nov 16, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An etching method includes applying a first electromagnetic radiation to an area of structure, thereby altering a characteristic of the structure in the area, and applying a second electromagnetic radiation to the structure, the second electromagnetic radiation configured to selectively ablate the structure based on the characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.