Jettable compositions
US7655174B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2003 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Dec 20, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y70/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A fully curable jettable composition having a viscosity less than 30 cps at a temperature within the range of 15-180° C., more preferably at a temperature of 15-100° C., e.g. 60-80° C. the composition comprising: (A) at least one low viscosity reactive resin selected from the group consisting of compounds containing an oxetane ring, cycloaliphatic epoxy resins, tetrahydrofurans, hexahydropyrans and mono-functional (meth)acrylates, said resin having a molecular weight of not greater than 300 Daltons, e.g. 250 Daltons or less, and a viscosity at a temperature in the said range of less than 30 cps, e.g. 5 to 15 cps; (B) at least one higher viscosity resin selected from the group consisting of epoxy resins, compounds containing an oxetane ring and acrylates, which resin acts to thicken the low viscosity resin and strengthen a jetted deposit of the composition, the higher viscosity resin having: a viscosity greater than twice that of the low viscosity resin at the said temperature in the range stated above, and a functionality of greater than or equal to 2; (C) at least one curable toughener, preferably having a functionality of at least 2, such as hydroxy, epoxy, acrylic or other react…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.