Resin composition for mold used in forming micropattern, and method for fabricating organic mold therefrom
US7655307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2004 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Jan 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31551
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resin composition for a mold used in forming micropatterns comprises (A) 40 to 90 parts by weight of an active energy curable urethane-based oligomer having a reactive group; (B) 10 to 60 parts by weight of a monomer reactive with the urethane-based oligomer, (C) 0.01 to 200 parts by weight of a silicone or fluorine containing compound, based on 100 parts of the sum of the components (A) and (B); and (D) 0.1 to 10 parts by weight of a photoinitiator, based on 100 parts of the sum of the components (A), (B) and (C). The inventive resin composition can be easily cured by the action of an active energy ray, and the organic mold fabricated therefrom is easily lifted off from a master without irreversible adhesion or generation of defects and have excellent dimensional and chemical stabilities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.