Adhesive compositions comprising a polyfarnesene
US7655739B1 · kind B1 · utility
36Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2009 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Jul 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31899
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopolymer derived from a farnesene (e.g., α-farnesene or β-farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an α-olefin such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.