Microphone module and method for fabricating the same
US7657025B2 · kind B2 · utility
8Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2006 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Dec 11, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone module. The module comprises a carrier having a first side and an opposing second side and comprising a through hole. A microphone is disposed on the first side of the carrier and corresponding to the through hole. A processing chip is disposed on the first side of the carrier and coupled to the microphone. An encapsulant is disposed on the first side of the carrier to encapsulate the microphone and the processing chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.