Techniques for cylindrical grinding
US7658665B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 9, 2007 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Oct 9, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods for cylindrical grinding a workpiece are disclosed. The method includes cylindrical grinding, with a bonded abrasive wheel having a permeable structure that includes interconnected porosity, a workpiece at a specific cutting energy of less than about 12 Hp/in3·min (29.7 J/mm3), and a material removal rate of at least about 1 in3/min·in (10.8 mm3/sec/mm)grinding. The bonded abrasive wheel may include at least about 3 volume percent of a filamentary sol-gel alpha-alumina abrasive grain having an average length-to-cross-sectional-width ratio of greater than about 4:1, or agglomerates thereof. In one embodiment, the workpiece is ground in the presence of a water soluble oil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.