Method for fixing metal particles and method for manufacturing substrate containing metal particles, method for manufacturing substrate containing carbon nanotube, and method for manufacturing substrate containing semiconductor-crystalline rod, employing thereof
US7658798B2 · kind B2 · utility
1Cited by
1References
31Claims
0Family size
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Key dates
| Filing date | Jul 20, 2004 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Dec 29, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/1094
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A metal fine particle is adhere to a predetermined location on a substrate. A resist film containing a metallic compound dispersed therein is formed on a substrate (101). A patterning of the resist film is conducted by a lithography. The substrate (101) having the patterned resist formed thereon is heated within an oxygen atmosphere to adhere a metal fine particle (106) to the surface of the substrate (101), while removing the resin in the patterned resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.