Solid-state imaging device and method of manufacturing said solid-state imaging device
US7659136B2 · kind B2 · utility
4Cited by
11References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 17, 2006 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Dec 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
Abstract
It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.