High power package with dual-sided heat sinking
US7659615B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 3, 2007 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | May 21, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly includes a semiconductor die disposed between an upper substrate and a lower substrate. A circuit board that defines a through hole is spaced axially below the upper substrate to define a gap between the upper substrate and the circuit board. An upper heat sink is thermally connected to the upper substrate by an upper thermal interface material to transfer heat in a first dissipation path to the upper heat sink. A lower heat sink is thermally connected to the lower substrate by a lower thermal interface material to transfer heat in a second dissipation path to the lower heat sink. A plurality of first interconnectors are disposed in the gap to solder the upper substrate to the circuit board. The assembly is distinguished by a plurality of second interconnectors that are disposed between the upper substrate and the lower substrate to position the lower substrate in the through hole of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.