Heat dissipating fin assembly for clamping dynamic random access memory to dissipate heat
US7660123B1 · kind B1 · utility
3Cited by
10References
9Claims
0Family size
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Key dates
| Filing date | Nov 24, 2008 |
| Grant date | Feb 9, 2010 |
| Priority date | — |
| Expiry date | Nov 24, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An exemplary heat dissipating fin assembly for clamping the DRAM to dissipate heat includes a number of heat dissipating fins arranged in a stacked fashion and a shaft. Each of the heat dissipating fins defines a pivoting hole and a slot therein. The slots of the heat dissipating fins are configured for receiving the DRAM. The shaft goes through the pivoting hole of each of the heat dissipating fins so as to string the heat dissipating fins. The heat dissipating fin assembly can enhance heat dissipating efficiency of the DRAM and reduce cost greatly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.