Stress isolated pressure sensing die, sensor assembly inluding said die and methods for manufacturing said die and said assembly
US7661318B2 · kind B2 · utility
13Cited by
8References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention concerns a pressure sensing die to be mounted on a base, comprising: wherein the pedestal is a composite pedestal comprising top and bottom platforms connected by at least one small link having a mean cross-section smaller than the cross-section of the top platform, said small link isolating at least some of the stresses, produced by the mounting of the pressure sensing die on the base, from said deflectable pressure sensing diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.