Cutting segment for diamond tool and diamond tool having the segment
US7661419B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 20, 2006 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Apr 20, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a cutting segment of a diamond tool for cutting or drilling a brittle workpiece such as stone, bricks, concrete and asphalt, and a diamond tool having the same. The invention allows superior cutting rate and lengthy useful life without suffering from R wear during cutting. In the cutting segment, a number of diamond particles are arranged in a plurality of plate-shaped layers stacked perpendicular to a cutting direction. Each of the diamond particle layers has a plurality of particle rows on a cutting surface. Further, at least two of the diamond particle layers are superimposed on at least one side of the cutting segment seen from the front of the cutting segment in cutting direction. The invention ensures uniform cutting by significantly reducing R wear that arises during cutting and thus enables superior cutting rate and longer useful life.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.