Heat sink assembly having a fin also functioning as a supporting bracket
US7661466B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 18, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jan 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat sink assembly (100) for cooling a heat-generating electronic component, includes a base plate (32), a plurality of fins (50) mounted on the base plate and a heat pipe (20) thermally connecting the base plate and the fins. The fins are parallel to the base plate and include a bottom fin (40) supporting the fins on the base plate. The bottom fin includes a plurality of supporting tabs (422) engaging with the base plate and separating a body (42) of the bottom fin from the base plate. The bottom fin can be used not only for dissipating heat into a surrounding environment but also for reinforcing the whole strength of the heat sink assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.