Electro-hydrodynamic gas flow cooling system
US7661468B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2006 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Aug 30, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
The present invention relates to cooling systems, and in particular to cooling systems providing forced convective gaseous flow. According to one aspect, a cooling system employs a heat sink in combination with an EHD pumping mechanism such as corona wind or micro-scale corona wind or by a temporally controlled ion-generation technique. A channel-array structure can be employed to embody the heat sink. The EHD pumps are located at the inlet or outlet of the heat sink channels. Many advantages are achieved by the cooling system of the invention, including that the entire system can have similar or better performance than a conventional heat sink and fan system but with one-tenth the volume and weight and can operate silently. The present invention also relates to a method of fabricating a micro-channel heat sink employing EHD gas flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.