Manufacturing method of thin keypad assembly
US7662327B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Oct 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0283
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
In a method of manufacturing a thin keypad of a keypad panel having a smooth surface, a mist surface or a lines layer, the method includes the steps of: preparing a mold with an internal bottom surface of a coarse surface, a smooth surface or a lines surface; applying an adhesive into the mold and coating a carrier onto the surface of the adhesive; rolling the surface of the carrier by a roller to level the adhesive in the mold; performing a ultraviolet projection to cure the adhesive to form a keypad layer on the carrier; filming a ground color layer, a function color layer and a font color layer sequentially on the carrier as the background of the keypad panel; and hot pressing and combining the keypad layer and silicon to produce the keypad panel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.