Self-assembled interconnection particles
US7662708B2 · kind B2 · utility
6Cited by
17References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2005 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jul 27, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a self-assembled interconnect structure is described. In the method, a contact pad surface and particles in a solution are brought together. The particles are selected such that they the particles adhere to the contact pad surface. Formation of a contact is completed by pressing an opposite contact into the particles such that an electrical connection is formed via the particles between the opposite contact pad and the substrate surface contact pad. The described self-assembled interconnect structure is particularly useful in display device fabrication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.