Liquid metal thermal interface material system
US7663227B2 · kind B2 · utility
6Cited by
6References
41Claims
0Family size
Inventors
Key dates
| Filing date | Feb 8, 2008 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Apr 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metal thermal interface structure for dissipating heat from electronic components comprised a heat spreader lid, metal alloy that is liquid over the operating temperature range of the electronic component, and design features to promote long-term reliability and high thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.