Multilayer electronic component and multilayer array electronic component
US7663453B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jan 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/40
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer array electronic component includes a multilayer composite including a helical coil and a capacitor that are defined by stacking a coil conductor, a capacitor conductor, and a ceramic sheet on one another. External electrodes are arranged on the surface of the multilayer composite and electrically connected to the helical coil or the capacitor. A direction identification mark is arranged on the upper surface of the multilayer composite and electrically connected to any of the external electrodes through the helical coil or the capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.