Band-pass filter element and high frequency module
US7663455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2007 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Sep 23, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/20345
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A high frequency module incorporates a layered substrate, a plurality of elements mounted on a top surface of the layered substrate, and a metallic casing that covers these elements. The plurality of elements mounted on the top surface of the layered substrate include a band-pass filter element. The band-pass filter element includes a plurality of conductor layers for band-pass filter and a plurality of dielectric layers for band-pass filter that implement a function of a band-pass filter, but does not include any conductor layer that functions as an electromagnetic shield. A conductor layer for grounding that the layered substrate includes and the casing are each opposed to the band-pass filter element, and thereby function as an electromagnetic shield for the band-pass filter element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.