Systems for providing conducting pad and fabrication method thereof
US7663728B2 · kind B2 · utility
4Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2006 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Jun 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12044
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for providing conducting pads of a display panel has a base layer on a substrate, a first insulator on the base layer having a plurality of grooves, a second conductive layer inside the grooves, and a patterned third conductive layer covering the second conductive layer. The first insulator serves as a barricade for fixing the second conductive layer in the grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.