Heat transfer mechanism, heat dissipation system, and communication apparatus
US7663883B2 · kind B2 · utility
92Cited by
17References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2004 |
| Grant date | Feb 16, 2010 |
| Priority date | — |
| Expiry date | Nov 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.