Patent · US Active

Method and apparatus for hole diameter profile measurement

US7665221B2 · kind B2 · utility

6Cited by
15References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 25, 2006
Grant dateFeb 23, 2010
Priority date
Expiry dateJan 14, 2027

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01B3/26
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method and apparatus for measuring the bore diameter of a hole as a function of hole depth is disclosed. In one embodiment, the apparatus comprises a diametric probe, for generating first measured bore diameter data along a diametric probe sensitive axis; a foot, for positioning the diametric probe sensitive axis in a plane parallel to the hole; a linear distance probe, coupled to the diametric probe, for generating first measured depth data describing the depth of the diametric probe sensitive axis within the hole; and a data acquisition system, for recording first measured bore diameter data from the diametric probe and first measured depth data from the linear distance probe of an insertion of the diametric probe into the hole.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.