Method of manufacturing printed circuit board using imprinting process
US7666292B2 · kind B2 · utility
0Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Feb 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.