Thick film conductor composition(s) and processing technology thereof for use in multilayer electronic circuits and devices
US7666328B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Aug 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.