Patent · US Active

Composition and method for providing a patterned metal layer having high conductivity

US7666568B2 · kind B2 · utility

9Cited by

15References

14Claims

0Family size

Assignee

E.I. DU PONT DE NEMOURS AND COMPANY · US

Inventors

Feng Gao · Beijing, CN
Lynda Kaye Johnson · Wilmington, US
Roupen Leon Keusseyan · Raleigh, US
Dalen E. Keys · Wilmington, US
Irina Malajovich · Swarthmore, US
Rinaldo S. Schiffino · Wilmington, US
Fredrick Claus Zumsteg, Jr. · Wilmington, US

Key dates

Filing date	Oct 23, 2007
Grant date	Feb 23, 2010
Priority date	—
Expiry date	Nov 25, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24802
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Disclosed is a method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.