Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof

US7666715B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Herbert Brunner · Sinzing, DE
• Harald Jäger · Regensburg, DE
• Jörg Erich Sorg · Regensburg, DE

Key dates

• Filing date: Dec 14, 2004
• Grant date: Feb 23, 2010
• Expiry date: Dec 14, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8511

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.