Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance
US7666768B2 · kind B2 · utility
15Cited by
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8Claims
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Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Aug 21, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method, apparatus and various material-architectures in an electrically conductive through die via formed of a composite material with a continuous phase of matrix metal and a dispersed phase of graphitic structures of carbon, wherein bulk material properties of the composite material differ from similar bulk material properties of the matrix metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.