Multilayer-structured bolometer and method of fabricating the same
US7667202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2008 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Jul 30, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.