Paper including semiconductor device and manufacturing method thereof
US7667310B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2007 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Jul 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/40
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.