Spaced, bumped component structure
US7667323B2 · kind B2 · utility
1Cited by
20References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2005 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Nov 10, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.