Pump structures integral to a fluid filled heat transfer apparatus
US7667969B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Feb 23, 2010 |
| Priority date | — |
| Expiry date | Mar 16, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Presented is a heat sink arrangement, incorporating a fluid media, which transfers heat between stationary and movable objects. Included are pump structures which are designed to be or operate integrally with the fluid-filled heat transfer apparatus, and are adapted to provide optimum and unique cooling flow paths for implementing the cooling of electronic devices, such as computer chips or the like, that require active cooling action. The pumps and heat sink arrangements selectively possess either rotating or stationary shafts, various types of impeller and fluid or cooling media circulation structures, which maximize both the convective and conductive cooling of the various components of the electronic devices or equipment by means of the circulating fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.