Patent · US Active

Workpiece with a recess which is closed from the exterior by means of a solder film and method for closing a recess by means of a solder film

US7669326B2 · kind B2 · utility

3Cited by

11References

11Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Andre Jeutter · Grafenau, DE
Silke Settegast · Berlin, DE

Key dates

Filing date	Dec 18, 2002
Grant date	Mar 2, 2010
Priority date	—
Expiry date	Jan 17, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49742
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

It is known from the prior art that holes in a workpiece are filled completely with a solder powder, which leads especially in the case of large holes to the formation of cracks within the solder due to the large volume filled in once the solder cools off after soldering. The invention provides a method for closing a recess of a workpiece, which allows closing an opening of a recess without the risk of crack formation, by using only a solder film for closing the recess. The solder film has a content of non-melting material and therefore is substantially less prone to form cracks.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.