Conductive layer, manufacturing method of the same, and signal transmission substrate
US7670144B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2006 |
| Grant date | Mar 2, 2010 |
| Priority date | — |
| Expiry date | Jun 17, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10598
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided a method of manufacturing a conductive layer of in a signal transmission substrate. The method includes sewing conductive thread in sheet-like material having an insulating property so as to form one of a plurality of low resistance regions using the conductive thread in a high resistance region formed by the sheet-like material, moving the conductive thread from an end point of a previously sewed low resistance region to a start point of a low resistance region to be sewed subsequently, repeating the sewing and moving steps to form the plurality of low resistance regions in the high resistance region, and forming a plurality of holes in the conductive layer by press working so that an electrical component attached to at least one of the plurality of holes is able to transmit a signal between neighboring ones of the plurality of low resistance regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.